Invention Application
US20140054549A1 GATED CIRCUIT STRUCTURE WITH ULTRA-THIN, EPITAXIALLY-GROWN TUNNEL AND CHANNEL LAYER 审中-公开
带超薄型,外延式隧道和通道层的门电路结构

  • Patent Title: GATED CIRCUIT STRUCTURE WITH ULTRA-THIN, EPITAXIALLY-GROWN TUNNEL AND CHANNEL LAYER
  • Patent Title (中): 带超薄型,外延式隧道和通道层的门电路结构
  • Application No.: US13592805
    Application Date: 2012-08-23
  • Publication No.: US20140054549A1
    Publication Date: 2014-02-27
  • Inventor: Wei-Yip LOHWei-E WANG
  • Applicant: Wei-Yip LOHWei-E WANG
  • Applicant Address: US NY Albany
  • Assignee: SEMATECH, INC.
  • Current Assignee: SEMATECH, INC.
  • Current Assignee Address: US NY Albany
  • Main IPC: H01L29/775
  • IPC: H01L29/775 H01L21/20
GATED CIRCUIT STRUCTURE WITH ULTRA-THIN, EPITAXIALLY-GROWN TUNNEL AND CHANNEL LAYER
Abstract:
A semiconductor device and tunnel field-effect transistor, and methods of fabrication thereof are provided. The device includes first and second semiconductor regions, an intermediate region, and an epitaxial layer. The intermediate region separates the first and second semiconductor regions, and the epitaxial layer extends at least partially between the first and second regions over or alongside of the intermediate region. A gate electrode is provided for gating the circuit structure. The epitaxial layer is disposed to reside between the gate electrode and at least one of the first semiconductor region, the second semiconductor region, or the intermediate region. The epitaxial layer includes an epitaxially-grown, ultra-thin body layer of semiconductor material with a thickness less than or equal to 15 nanometers. Where the semiconductor device is a tunneling field-effect transistor, the intermediate region may be a large band-gap semiconductor region, with a band-gap greater than that of the epitaxial layer.
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/775 .....带有一维载流子气沟道的,如量子线FET
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