Invention Application
- Patent Title: TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE COMPRISING THE SAME
- Patent Title (中): 端子结构和包含其的半导体元件和模块基板
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Application No.: US13960291Application Date: 2013-08-06
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Publication No.: US20140054769A1Publication Date: 2014-02-27
- Inventor: Kenichi YOSHIDA , Makoto ORIKASA , Hideyuki SEIKE , Yuhei HORIKAWA , Hisayuki ABE
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2012-185031 20120824
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.
Public/Granted literature
- US08970037B2 Terminal structure, and semiconductor element and module substrate comprising the same Public/Granted day:2015-03-03
Information query
IPC分类:
