Invention Application
US20140055228A1 CHIP RESISTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
芯片电阻器件及其制造方法

CHIP RESISTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Abstract:
A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.
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