公开(公告)号：US20140055228A1

公开(公告)日：2014-02-27

申请号：US13790064

申请日：2013-03-08

Applicant: RALEC ELECTRONIC CORPORATION

Inventor： Wan-Ping Wang

IPC: H01C17/00 ,  H01C1/142

CPC classification number: H01C17/006 ,  H01C1/142 ,  H01C13/02 ,  H01C17/281 ,  Y10T29/49082

Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.

Abstract translation: 片式电阻器件包括绝缘衬底，两个缩进图案和电阻器单元。 绝缘基板具有相对的第一和第二表面。 第一表面具有分别与两个相对边缘相邻的两个相对边缘和两个电极形成区域。 凹入图案分别形成在第一表面的电极形成区域中并且从第一表面缩进。 电阻器单元包括分别形成在第一表面的电极形成区域上并被填充到凹入图案中的两个接触电极，以及形成在两个接触电极之间的第一表面上并与接触电极电接触的电阻器。

公开(公告)号：US09991032B2

公开(公告)日：2018-06-05

申请号：US14946155

申请日：2015-11-19

Applicant: RALEC ELECTRONIC CORPORATION

Inventor： Wan-Ping Wang

IPC: H01C17/00 ,  H01C17/08 ,  H01C17/28 ,  H01C7/00 ,  B05D5/00 ,  B05C11/00 ,  B05D1/32 ,  H01C7/06

CPC classification number: H01C17/006 ,  B05C11/00 ,  B05D1/32 ,  B05D5/00 ,  H01C7/006 ,  H01C7/06 ,  H01C17/08 ,  H01C17/28

Abstract: A method for manufacturing a thin film chip resistor device includes the steps of: disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements.

公开(公告)号：US08854175B2

公开(公告)日：2014-10-07

申请号：US13790064

申请日：2013-03-08

Applicant: Ralec Electronic Corporation

Inventor： Wan-Ping Wang

IPC: H01C1/012 ,  H01C17/28 ,  H01C13/02 ,  H01C1/142 ,  H01C17/00

CPC classification number: H01C17/006 ,  H01C1/142 ,  H01C13/02 ,  H01C17/281 ,  Y10T29/49082

Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.

Abstract translation: 片式电阻器件包括绝缘衬底，两个缩进图案和电阻器单元。 绝缘基板具有相对的第一和第二表面。 第一表面具有分别与两个相对边缘相邻的两个相对边缘和两个电极形成区域。 凹入图案分别形成在第一表面的电极形成区域中并且从第一表面缩进。 电阻器单元包括分别形成在第一表面的电极形成区域上并被填充到凹入图案中的两个接触电极，以及形成在两个接触电极之间的第一表面上并与接触电极电接触的电阻器。