According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a plurality of insulative separating films, a channel body, and a memory film. The stacked body includes a plurality of electrode layers and a plurality of insulating layers. The plurality of insulative separating films separates the stacked body into a plurality. The channel body extends in the stacking direction between the plurality of insulative separating films. A width of the electrode layer of a lower layer side between the insulative separating film and the memory film is greater than a width of the electrode layer of an upper layer side between the insulative separating film and the memory film. An electrical resistivity of the electrode layer is higher for the electrode layer of the lower layer side having the greater width than for the electrode layer of the upper layer side having the lesser width.