发明申请
- 专利标题： INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT
- 专利标题（中）： 集成电路和一体化集成电路的制造方法
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申请号： US13602359申请日： 2012-09-04
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公开(公告)号： US20140061878A1公开(公告)日： 2014-03-06
- 发明人: Joachim Mahler , Lukas Ossowski , Khalil Hosseini , Ivan Nikitin
- 申请人： Joachim Mahler , Lukas Ossowski , Khalil Hosseini , Ivan Nikitin
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/56 ; H01L23/495
摘要：
An integrated circuit is provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material.
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