The invention discloses an x-ray system that produces highly magnified images of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies.Specifically, the object is illuminated by collimated, high-flux x-rays from an extended source, with the x-ray wavelength selected to provide contrast for the internal structures of the object. The system also comprises a stage to control the position and orientation of the object; a scintillator, positioned in close proximity to the object, that absorbs x-rays and emits visible photons; an optical imaging system that forms a high-resolution magnified image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.The x-ray system may also be utilized in methods for high speed metrology or inspection, which in turn enable rapid process development, as well as manufacturing process control and yield management.