公开(公告)号：US09607724B2

公开(公告)日：2017-03-28

申请号：US14732674

申请日：2015-06-06

申请人： David Lewis Adler

发明人： David Lewis Adler

IPC分类号： G21K7/00 ,  G01N23/04

CPC分类号： G21K7/00 ,  G01N23/04 ,  G01N23/083 ,  G06T7/0002 ,  G21K2207/005 ,  H01L22/12

摘要： Objects undergoing processing by a high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

公开(公告)号：US20160351283A1

公开(公告)日：2016-12-01

申请号：US15231774

申请日：2016-08-08

申请人： David Lewis Adler ,  Benjamin Thomas Adler ,  Freddie Erich Babian

发明人： David Lewis Adler ,  Benjamin Thomas Adler ,  Freddie Erich Babian

IPC分类号： G21K7/00

CPC分类号： G21K7/00 ,  G01N23/04 ,  G01N23/083 ,  G06T7/0002 ,  G21K2207/005 ,  H01L22/12

摘要： A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from a movable, extended source having a designated x-ray spectrum. The system also comprises a means to control the relative positions of the x-ray source and the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

摘要翻译： 具有高通量x射线源的高分辨率x射线显微镜，可以对诸如集成电路（IC），印刷电路板（PCB）和其他IC封装技术的物体进行高速计量或检测。 待调查的物体由具有指定的X射线光谱的可移动的扩展源的准直的高通量X射线照射。 该系统还包括控制x射线源和物体的相对位置的装置; 吸收x射线并发射位于与物体非常接近（或接触）的可见光子的闪烁体; 形成由闪烁体发射的光子的高度放大的高分辨率图像的光学成像系统; 以及诸如CCD阵列的检测器，以将图像转换成电子信号。

公开(公告)号：US09129715B2

公开(公告)日：2015-09-08

申请号：US13987808

申请日：2013-09-04

申请人： David Lewis Adler ,  Benjamin Thomas Adler ,  Freddie Erich Babian

发明人： David Lewis Adler ,  Benjamin Thomas Adler ,  Freddie Erich Babian

IPC分类号： G21K7/00

CPC分类号： G21K7/00 ,  G01N23/04 ,  G01N23/083 ,  G06T7/0002 ,  G21K2207/005 ,  H01L22/12

摘要： A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

摘要翻译： 具有高通量x射线源的高分辨率x射线显微镜，可以对诸如集成电路（IC），印刷电路板（PCB）和其他IC封装技术的物体进行高速计量或检验。 待调查对象由来自具有指定的x射线谱的扩展源的准直的高通量X射线照射。 该系统还包括一个控制对象的位置和方位的阶段; 吸收x射线并发射位于与物体非常接近（或接触）的可见光子的闪烁体; 形成由闪烁体发射的光子的高度放大的高分辨率图像的光学成像系统; 以及诸如CCD阵列的检测器，以将图像转换成电子信号。

公开(公告)号：US20140064445A1

公开(公告)日：2014-03-06

申请号：US13987808

申请日：2013-09-04

申请人： David Lewis Adler

发明人： David Lewis Adler

IPC分类号： G21K7/00

CPC分类号： G21K7/00 ,  G01N23/04 ,  G01N23/083 ,  G06T7/0002 ,  G21K2207/005 ,  H01L22/12

摘要： The invention discloses an x-ray system that produces highly magnified images of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies.Specifically, the object is illuminated by collimated, high-flux x-rays from an extended source, with the x-ray wavelength selected to provide contrast for the internal structures of the object. The system also comprises a stage to control the position and orientation of the object; a scintillator, positioned in close proximity to the object, that absorbs x-rays and emits visible photons; an optical imaging system that forms a high-resolution magnified image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.The x-ray system may also be utilized in methods for high speed metrology or inspection, which in turn enable rapid process development, as well as manufacturing process control and yield management.

摘要翻译： 本发明公开了一种产生诸如集成电路（IC），印刷电路板（PCB）和其它IC封装技术的物体的高度放大图像的x射线系统。 具体来说，物体被来自扩展源的准直的高通量X射线照射，其中x射线波长被选择为对象的内部结构提供对比度。 该系统还包括一个控制对象的位置和方位的阶段; 位于靠近物体的闪烁体，其吸收x射线并发射可见光子; 形成由闪烁体发射的光子的高分辨率放大图像的光学成像系统; 以及诸如CCD阵列的检测器，以将图像转换成电子信号。 x射线系统也可以用于高速计量或检测的方法，这又可以实现快速的过程开发，以及制造过程控制和产量管理。

公开(公告)号：US20160203938A1

公开(公告)日：2016-07-14

申请号：US15076556

申请日：2016-03-21

申请人： David Lewis Adler

发明人： David Lewis Adler

IPC分类号： H01J1/78 ,  H01L27/02 ,  H01L23/498 ,  G21K7/00

CPC分类号： G21K1/00 ,  G01N23/04 ,  G01N2223/1006 ,  G01N2223/611 ,  G21K7/00 ,  H01J1/78 ,  H01L23/49827 ,  H01L27/0203

摘要： An apparatus is disclosed for the examination and inspection of integrated devices such as integrated circuits. X-rays are transmitted through the integrated device, and are incident on a photoemissive structure that absorbs x-rays and emits electrons. The electrons emitted by the photoemissive structure are shaped by an electron optical system to form a magnified image of the emitted electrons on a detector. This magnified image is then recorded and processed.For some embodiments of the invention, the photoemissive structure is deposited directly onto the integrated device. In some embodiments, the incidence angle of the x-rays is varied to allow internal three-dimensional structures of the integrated device to be determined. In other embodiments, the recorded image is compared with a reference data to enable inspection for manufacturing quality control.

摘要翻译： 公开了用于集成电路等集成装置的检查和检查的装置。 X射线通过集成器件传输，入射到吸收x射线并发射电子的光发射结构上。 由发光结构发射的电子通过电子光学系统成形，以在检测器上形成发射电子的放大图像。 然后记录和处理该放大的图像。 对于本发明的一些实施例，光发射结构直接沉积在集成器件上。 在一些实施例中，X射线的入射角度被改变以允许确定集成器件的内部三维结构。 在其他实施例中，将记录的图像与参考数据进行比较，以使得能够进行制造质量控制的检查。

公开(公告)号：US20150270023A1

公开(公告)日：2015-09-24

申请号：US14732674

申请日：2015-06-06

申请人： David Lewis Adler

发明人： David Lewis Adler

IPC分类号： G21K7/00 ,  G01N23/04

CPC分类号： G21K7/00 ,  G01N23/04 ,  G01N23/083 ,  G06T7/0002 ,  G21K2207/005 ,  H01L22/12

摘要： Objects undergoing processing by a high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

摘要翻译： 通过具有高通量x射线源的高分辨率X射线显微镜进行处理的物体，允许对诸如集成电路（IC），印刷电路板（PCB）和其他IC封装技术的物体进行高速计量或检验。 待调查对象由来自具有指定的x射线谱的扩展源的准直的高通量X射线照射。 该系统还包括一个控制对象的位置和方位的阶段; 吸收x射线并发射位于与物体非常接近（或接触）的可见光子的闪烁体; 形成由闪烁体发射的光子的高度放大的高分辨率图像的光学成像系统; 以及诸如CCD阵列的检测器，以将图像转换成电子信号。