In production of a mold having a deposited film on the surface thereof as a mold release layer, a quartz substrate plasma etched employing an etching gas that includes a sedimentary gas to form a pattern of protrusions and recesses having a desired shape in a structure constituted by the quartz substrate and a mask layer, while a deposited film constituted by sediment of the sedimentary gas is formed along the pattern of protrusions and recesses. The deposited film becomes the mold release layer. Thereby, throughput of mold production is improved in the production of molds having deposited films as mold release layers on the surfaces thereof.