Disclosed are multi-chip packaging structures and methods. In one embodiment, a multi-chip packaging structure can include: (i) N chips, where N is an integer of at least two, and where an upper surface of each chip comprises a plurality of pads; (ii) a lead frame with a chip carrier and a plurality of pins, where the N chips are stacked in layers on the chip carrier, and where a chip in an upper layer partially covers a chip in a lower layer such that the plurality of pads of the lower layer chip are exposed; (iii) a plurality of first bonding leads configured to connect pads on one chip to pads on another chip; and (iv) a plurality of second bonding leads configured to connect pads on at least one chip to the plurality of pins for external connection to the multi-chip packaging structure.