发明申请
- 专利标题： MOLD AND MOLD BLANK SUBSTRATE
- 专利标题（中）： 模具和模具底座
-
申请号： US13731617申请日： 2012-12-31
-
公开(公告)号： US20140072668A1公开(公告)日： 2014-03-13
- 发明人: Ikuo YONEDA , Tetsuro Nakasugi
- 申请人： Ikuo YONEDA , Tetsuro Nakasugi
- 优先权： JP2012-197806 20120907
- 主分类号： B29C59/02
- IPC分类号： B29C59/02
摘要：
According to one embodiment, a mold includes a base material, a pedestal portion and a pattern portion. The base material includes a first surface and a second surface. The pedestal portion protruded from the first surface of the base material and includes a side surface. The pattern portion is provided in the pedestal portion and includes an concave-convex pattern. The pedestal portion includes a first region and a second region. The first region is provided with the concave-convex pattern. The second region is provided between the first region and the side surface. The second region has maximum height equal to maximum height of the first region. The second region has a first height of the second region on the side surface side and a second height of the second region on the first region side. The first height is lower than the second height.
信息查询
