发明申请
US20140072822A1 PRIMER FOR ELECTROLESS PLATING COMPRISING HYPERBRANCHED POLYMER AND METAL FINE PARTICLES 有权
用于包覆高分子聚合物和金属细颗粒的电沉积聚合物

  • 专利标题: PRIMER FOR ELECTROLESS PLATING COMPRISING HYPERBRANCHED POLYMER AND METAL FINE PARTICLES
  • 专利标题(中): 用于包覆高分子聚合物和金属细颗粒的电沉积聚合物
  • 申请号: US14111396
    申请日: 2012-04-11
  • 公开(公告)号: US20140072822A1
    公开(公告)日: 2014-03-13
  • 发明人: Keisuke Kojima
  • 申请人: Keisuke Kojima
  • 申请人地址: JP Tokyo
  • 专利权人: NISSAN CHEMICAL INDUSTRIES, LTD.
  • 当前专利权人: NISSAN CHEMICAL INDUSTRIES, LTD.
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2011-088587 20110412; JP2011-156026 20110714; JP2011-231910 20111021
  • 国际申请: PCT/JP2012/059901 WO 20120411
  • 主分类号: C09D125/06
  • IPC分类号: C09D125/06 C23C18/18
PRIMER FOR ELECTROLESS PLATING COMPRISING HYPERBRANCHED POLYMER AND METAL FINE PARTICLES
摘要:
There is provided a novel, environmentally friendly primer for use in the pretreatment steps in electroless plating, which can be easily used in fewer steps with a lower cost. A primer for forming a metallic plating film on a substrate by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle.
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