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公开(公告)号:US20230061536A1
公开(公告)日:2023-03-02
申请号:US17755748
申请日:2021-08-30
摘要: Compositions for electroless plating baths and their use are disclosed, and more particularly different solutions each usable to both makeup an original bath and to replenishment of the original bath.
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公开(公告)号:US20230009692A1
公开(公告)日:2023-01-12
申请号:US17368997
申请日:2021-07-07
发明人: Songjae LEE , Hao WANG , David JORGENSEN , Yi-Chiau HUANG
IPC分类号: C23C18/32 , C30B23/02 , C23C18/16 , C23C16/32 , C23C16/455 , C30B29/06 , C23C18/18 , C23C16/458
摘要: Embodiments of the present disclosure generally relate to a substrate support having a two-part surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an upper surface and a two-part coating disposed over the upper surface of the body. The two-part coating includes a first coating layer extending a first radial distance from a center of the body. The first coating layer includes at least one of a metal-containing material or alloy. The two-part coating includes a second coating layer disposed over the first coating layer. The second coating layer extends a second radial distance from the center of the body. The first radial distance is greater than the second radial distance. The second coating layer is non-metal.
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公开(公告)号:US20220356571A1
公开(公告)日:2022-11-10
申请号:US17871810
申请日:2022-07-22
发明人: Peng-Cheng HONG , Jun-Liang Pu , W.L. Hsu , Chung-Hao Kao , Chia-Chun Hung , Cheng-Yi Wu , Chin-Szu Lee
IPC分类号: C23C16/44 , C23C14/02 , C23C18/18 , B29D99/00 , C23C14/34 , C25D7/04 , H01J37/32 , C23C14/20
摘要: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
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公开(公告)号:US11447871B2
公开(公告)日:2022-09-20
申请号:US16406062
申请日:2019-05-08
发明人: Shotaro Nakamura
IPC分类号: C23C18/16 , H01L21/02 , B05C11/10 , B05C3/02 , H01L21/67 , C25D5/08 , H01L21/288 , C23C18/18
摘要: There is provided a technique capable of forming a plating film excellent in film thickness and quality uniformity on a to-be-plated surface of a semiconductor wafer while suppressing an increase in costs of facilities. An apparatus for manufacturing a semiconductor device includes: a reaction bath; a supply pipe provided inside the reaction bath and including a plurality of ejection holes for ejecting the reaction solution, the ejecting holes being arranged in a longitudinal direction of the supply pipe; and an outer bath serving as a reservoir bath provided adjacent to the reaction bath on a first end side of the supply pipe and storing therein the reaction solution overflowed the reaction bath. The aperture ratio of part of the ejection holes more distant from the outer bath is at least partially higher than that of part of the ejection holes closer to the outer bath.
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公开(公告)号:US20220251709A1
公开(公告)日:2022-08-11
申请号:US17596385
申请日:2020-06-04
发明人: Takafumi Niwa
摘要: A substrate processing method includes activating, accumulating, forming a plating film, performing a post-processing and drying. In the activating, a plating liquid L1 is activated by heating and maintaining the plating liquid at a preset temperature. In the accumulating, the activated plating liquid is accumulated on a substrate W. In the forming of the plating film, the plating film is formed on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated. In the performing of the post-processing, the post-processing is performed on the substrate on which the plating film is formed. In the drying, the substrate after being subjected to the post-processing is dried. Activating the plating liquid for the substrate to be processed next is performed in parallel with the forming of the plating film, the performing of the post-processing, and the drying upon the substrate being processed currently.
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6.
公开(公告)号:US11186657B2
公开(公告)日:2021-11-30
申请号:US16445599
申请日:2019-06-19
发明人: Naoki Usuki , Akiko Kito , Atsushi Yusa
IPC分类号: C08F12/30 , C22B11/00 , B01J20/26 , B01J20/32 , C23C18/18 , C08F212/36 , C08F220/56 , C08F8/30 , C08F293/00
摘要: There is provided a hyper-branched polymer represented by the following formula (1) and having a weight-average molecular weight in a range of 1,000 to 1,000,000. In the formula (1), A1 is a group containing an aromatic ring, A2 is a group containing an amide group, A3 is a group containing sulfur, R0 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, ml is in a range of 0.5 to 11, and n1 is in a range of 5 to 100.
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公开(公告)号:US20210292906A1
公开(公告)日:2021-09-23
申请号:US17260340
申请日:2019-06-10
发明人: Zhengyin HAI , Guoxin TIAN , Qian XU , Changsheng XIN , Suliang YANG , Hui WANG
摘要: A method of preparing a graphene coating on a metal surface, the method includes: pretreating the metal surface of a metal sample; immersing, spraying or hang brushing the metal sample with the pretreated metal surface by using a graphene oxide aqueous solution, so that the grapheme oxide aqueous solution covers inner and outer surfaces of the metal sample; baking and drying the metal sample covered with the graphene oxide aqueous solution; performing a microwave reduction treatment on the baked and dried metal sample; taking out the microwave-reduced metal sample, cleaning the metal sample with a cleaning agent to obtain a metal coated with the graphene coating.
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公开(公告)号:US11081417B2
公开(公告)日:2021-08-03
申请号:US16514853
申请日:2019-07-17
发明人: Sook Woon Chan , Chau Fatt Chiang , Kok Yau Chua , Soon Lock Goh , Swee Kah Lee , Joachim Mahler , Mei Chin Ng , Beng Keh See , Guan Choon Matthew Nelson Tee
IPC分类号: H01L23/552 , H01L23/31 , C09D5/24 , C23C18/16 , C23C18/18 , H01L23/29 , C09D5/00 , C09D201/00 , C23C18/34 , H01L21/56 , H01L23/66 , H01L23/00
摘要: A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.
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公开(公告)号:US11078572B2
公开(公告)日:2021-08-03
申请号:US16247443
申请日:2019-01-14
发明人: Huaiyuan Wang , Ziyi Hu , Yanji Zhu , Yixing Zhu , Chijia Wang
IPC分类号: C25D11/34 , C23C18/16 , C23C18/50 , C23C18/18 , C25D5/48 , C25D5/08 , C25D17/00 , C25D5/14 , C25D7/04 , C25D5/50 , C25D5/34 , C25D5/44 , C25D15/00 , C25D3/18 , C25D5/20 , C25D5/36 , C23C18/36
摘要: Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology. Nano-scale channels structures are etched, so that the super-hydrophobic inner surface can have a better ability to store air, and its water flow impact resistance is greatly enhanced.
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公开(公告)号:US11028484B2
公开(公告)日:2021-06-08
申请号:US16345684
申请日:2017-10-30
发明人: Shengqin Wang , Yew Wei Leong
IPC分类号: C23C18/32 , C08K3/013 , C08K5/05 , C08K5/17 , C08L83/04 , C23C18/12 , C23C18/16 , C23C18/18 , C23C18/20 , C23C18/28 , C23C18/30 , H01B1/22 , C08K3/22
摘要: According to the present disclosure, a method for coating nickel on an organosiloxane polymer wherein the said method comprises the steps of; forming a transition metal oxide on the organosiloxane polymer; etching the transition metal oxide with a basic solution; contacting the organosiloxane polymer comprising the etched transition metal oxide with an aqueous solution comprising a positively charged species to attach the positively charged species on the etched transition metal oxide; depositing a metal catalyst on the positively charged species; and treating the metal catalyst with an acidic solution to develop an activated organosiloxane polymer before transferring the activated organosiloxane polymer to a solution comprising nickel and/or nickel derivatives. A nickel organosiloxane composite is provided herein comprising a transition metal oxide layer and a positively charged species attached on the said oxide layer with nickel coated in the said positively charged species.
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