COATED SUBSTRATE SUPPORT ASSEMBLY FOR SUBSTRATE PROCESSING

    公开(公告)号:US20230009692A1

    公开(公告)日:2023-01-12

    申请号:US17368997

    申请日:2021-07-07

    摘要: Embodiments of the present disclosure generally relate to a substrate support having a two-part surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an upper surface and a two-part coating disposed over the upper surface of the body. The two-part coating includes a first coating layer extending a first radial distance from a center of the body. The first coating layer includes at least one of a metal-containing material or alloy. The two-part coating includes a second coating layer disposed over the first coating layer. The second coating layer extends a second radial distance from the center of the body. The first radial distance is greater than the second radial distance. The second coating layer is non-metal.

    Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device

    公开(公告)号:US11447871B2

    公开(公告)日:2022-09-20

    申请号:US16406062

    申请日:2019-05-08

    发明人: Shotaro Nakamura

    摘要: There is provided a technique capable of forming a plating film excellent in film thickness and quality uniformity on a to-be-plated surface of a semiconductor wafer while suppressing an increase in costs of facilities. An apparatus for manufacturing a semiconductor device includes: a reaction bath; a supply pipe provided inside the reaction bath and including a plurality of ejection holes for ejecting the reaction solution, the ejecting holes being arranged in a longitudinal direction of the supply pipe; and an outer bath serving as a reservoir bath provided adjacent to the reaction bath on a first end side of the supply pipe and storing therein the reaction solution overflowed the reaction bath. The aperture ratio of part of the ejection holes more distant from the outer bath is at least partially higher than that of part of the ejection holes closer to the outer bath.

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20220251709A1

    公开(公告)日:2022-08-11

    申请号:US17596385

    申请日:2020-06-04

    发明人: Takafumi Niwa

    IPC分类号: C23C18/18 C23C18/31 C23C18/16

    摘要: A substrate processing method includes activating, accumulating, forming a plating film, performing a post-processing and drying. In the activating, a plating liquid L1 is activated by heating and maintaining the plating liquid at a preset temperature. In the accumulating, the activated plating liquid is accumulated on a substrate W. In the forming of the plating film, the plating film is formed on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated. In the performing of the post-processing, the post-processing is performed on the substrate on which the plating film is formed. In the drying, the substrate after being subjected to the post-processing is dried. Activating the plating liquid for the substrate to be processed next is performed in parallel with the forming of the plating film, the performing of the post-processing, and the drying upon the substrate being processed currently.

    METHOD OF PREPARING GRAPHENE COATING ON METAL SURFACE

    公开(公告)号:US20210292906A1

    公开(公告)日:2021-09-23

    申请号:US17260340

    申请日:2019-06-10

    IPC分类号: C23C18/16 C23C18/18

    摘要: A method of preparing a graphene coating on a metal surface, the method includes: pretreating the metal surface of a metal sample; immersing, spraying or hang brushing the metal sample with the pretreated metal surface by using a graphene oxide aqueous solution, so that the grapheme oxide aqueous solution covers inner and outer surfaces of the metal sample; baking and drying the metal sample covered with the graphene oxide aqueous solution; performing a microwave reduction treatment on the baked and dried metal sample; taking out the microwave-reduced metal sample, cleaning the metal sample with a cleaning agent to obtain a metal coated with the graphene coating.

    Electroless nickel plating of silicone rubber

    公开(公告)号:US11028484B2

    公开(公告)日:2021-06-08

    申请号:US16345684

    申请日:2017-10-30

    摘要: According to the present disclosure, a method for coating nickel on an organosiloxane polymer wherein the said method comprises the steps of; forming a transition metal oxide on the organosiloxane polymer; etching the transition metal oxide with a basic solution; contacting the organosiloxane polymer comprising the etched transition metal oxide with an aqueous solution comprising a positively charged species to attach the positively charged species on the etched transition metal oxide; depositing a metal catalyst on the positively charged species; and treating the metal catalyst with an acidic solution to develop an activated organosiloxane polymer before transferring the activated organosiloxane polymer to a solution comprising nickel and/or nickel derivatives. A nickel organosiloxane composite is provided herein comprising a transition metal oxide layer and a positively charged species attached on the said oxide layer with nickel coated in the said positively charged species.