Invention Application
- Patent Title: ELECTROCHEMICAL ETCHING APPARATUS
- Patent Title (中): 电化学蚀刻装置
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Application No.: US13618564Application Date: 2012-09-14
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Publication No.: US20140076738A1Publication Date: 2014-03-20
- Inventor: Shu-Jen Han , Lian Guo , Xuesong Li
- Applicant: Shu-Jen Han , Lian Guo , Xuesong Li
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: C25F3/02
- IPC: C25F3/02

Abstract:
An electroplating etching apparatus includes a power supply to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.
Public/Granted literature
- US09062389B2 Electrochemical etching apparatus Public/Granted day:2015-06-23
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