Techniques for fabricating organic light emitting devices, and devices fabricating using the disclosed techniques, are provided. In the disclosed techniques, a layer including an emissive material and a buffer material may be deposited in a single laser transfer process, such as a laser-induced thermal imaging process. The emissive and buffer materials may be deposited in discrete layers during the transfer process. Examples of buffer materials as disclosed include blocking materials, transfer materials, and the like. Additional layers may be deposited using conventional techniques or additional laser transfer processes.