Invention Application
- Patent Title: INTEGRATED CIRCUIT AND SEAL RING
- Patent Title (中): 集成电路和密封圈
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Application No.: US13615673Application Date: 2012-09-14
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Publication No.: US20140077341A1Publication Date: 2014-03-20
- Inventor: Bing-Jye Kuo , Hong-Wen Lin , Yu-Jie Ji
- Applicant: Bing-Jye Kuo , Hong-Wen Lin , Yu-Jie Ji
- Applicant Address: US CA San Diego
- Assignee: VIA TELECOM, INC.
- Current Assignee: VIA TELECOM, INC.
- Current Assignee Address: US CA San Diego
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.
Public/Granted literature
- US08933539B2 Integrated circuit and seal ring Public/Granted day:2015-01-13
Information query
IPC分类:
