Invention Application
US20140077376A1 SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND METHOD FOR SOLDERING A SEMICONDUCTOR CHIP TO A CARRIER
有权
半导体芯片，用于制造半导体芯片的方法和用于将半导体芯片焊接到载体上的方法
- Patent Title: SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND METHOD FOR SOLDERING A SEMICONDUCTOR CHIP TO A CARRIER
- Patent Title (中): 半导体芯片，用于制造半导体芯片的方法和用于将半导体芯片焊接到载体上的方法
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Application No.: US14027603Application Date: 2013-09-16
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Publication No.: US20140077376A1Publication Date: 2014-03-20
- Inventor: Frank Umbach , Niels Oeschler , Kirill Trunov
- Applicant: Infineon Technologies AG
- Priority: DE102012216546.0 20120917
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/50
Abstract:
A semiconductor chip includes a semiconductor body and a chip metallization applied on the semiconductor body. The chip metallization has an underside facing away from the semiconductor body. The chip further includes a layer stack applied to the underside of the chip metallization and having a number N1≧1 or N1≧2 of first partial layers and a number N2≧2 of second partial layers. The first partial layers and the second partial layers are arranged alternately and successively such that at least one of the second partial layers is arranged between the first partial layers of each first pair of the first partial layers and such that at least one of the first partial layers is arranged between the second partial layers of each second pair of the second partial layers.
Public/Granted literature
Information query
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