Invention Application
- Patent Title: LIGHT EMITTING DEVICE PACKAGE AND HEADLIGHT FOR VEHICLE HAVING THE SAME
- Patent Title (中): 发光装置包装和具有其的车辆的头灯
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Application No.: US13926241Application Date: 2013-06-25
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Publication No.: US20140078763A1Publication Date: 2014-03-20
- Inventor: Hee Seok PARK , Ji Seok WANG , Kwon Jin KIM , Hee Dong KIM
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2012-0103041 20120917
- Main IPC: H01L33/50
- IPC: H01L33/50 ; F21S8/10
Abstract:
A light emitting device package according to example embodiments includes a plurality of light emitting device chips arranged linearly and spaced apart from each other on a substrate, and a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips. The plurality of wavelength conversion units may each have portions that extend over regions between the plurality of light emitting device chips. A vehicle headlight may include the light emitting device package.
Public/Granted literature
- US09166124B2 Light emitting device package and headlight for vehicle having the same Public/Granted day:2015-10-20
Information query
IPC分类:
