Invention Application
US20140080264A1 METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE
审中-公开
用于制造基于引线框架的半导体封装的方法
- Patent Title: METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE
- Patent Title (中): 用于制造基于引线框架的半导体封装的方法
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Application No.: US14086142Application Date: 2013-11-21
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Publication No.: US20140080264A1Publication Date: 2014-03-20
- Inventor: Chang-Yueh Chan , Chih-Ming Huang , Chun-Yuan Li , Chih-Hsin Lai
- Applicant: Siliconware Precision Industries Co., Ltd
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD
- Current Assignee Address: TW Taichung
- Priority: TW096129512 20070810
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56

Abstract:
A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.
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