公开(公告)号：US08716070B2

公开(公告)日：2014-05-06

申请号：US13834684

申请日：2013-03-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

IPC: H01L21/56 ,  H01L31/0203

CPC classification number: B81B7/0064 ,  B81B7/007 ,  B81B2207/095 ,  H01L21/56 ,  H01L23/315 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.

Abstract translation: 提供具有至少MEMS元件的封装结构的制造方法，包括：制备具有电连接焊盘和所述至少MEMS元件的晶片; 设置用于覆盖所述至少一个MEMS元件的盖，所述盖具有在其上形成的金属层; 电连接焊盘和金属层与接合线; 形成用于覆盖盖子，接合线，电连接垫和金属层的密封剂; 去除所述密封剂的部分以将所述接合线分别分离成第一和第二子接合线，其中所述第一和第二次接合线的顶端被暴露，所述第一子接合线电连接到所述电连接焊盘，以及 所述第二子接合线电连接到所述金属层; 在所述密封剂上形成用于电连接到所述第一子接合线的金属迹线; 在金属痕迹上形成凸块; 并执行单独处理。

公开(公告)号：US20230053125A1

公开(公告)日：2023-02-16

申请号：US17978493

申请日：2022-11-01

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L23/498 ,  H01L21/48

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US11521930B2

公开(公告)日：2022-12-06

申请号：US17068988

申请日：2020-10-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/498

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US11605554B2

公开(公告)日：2023-03-14

申请号：US17392462

申请日：2021-08-03

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L21/68 ,  H01L23/00 ,  H01L21/683

Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

公开(公告)号：US20220148975A1

公开(公告)日：2022-05-12

申请号：US17134925

申请日：2020-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L25/00

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US09254994B2

公开(公告)日：2016-02-09

申请号：US14487602

申请日：2014-09-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

IPC: H01L29/24 ,  B81B7/00 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00

CPC classification number: B81B7/0064 ,  B81B7/007 ,  B81B2207/095 ,  H01L21/56 ,  H01L23/315 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

Abstract translation: 提供具有至少MEMS元件的封装结构，其包括具有电连接焊盘和MEMS元件的芯片; 设置在所述芯片上以覆盖所述MEMS元件并且具有设置在其上的金属层的盖; 电连接到电连接焊盘的第一子接合线; 电连接到金属层的第二子接合线; 设置在所述芯片上的密封剂，其中所述第一和第二子接合线的顶端从所述密封剂露出; 以及设置在密封剂上并电连接到第一子接合线的金属迹线。 封装结构有利地具有减小的尺寸，相对低的成本，不同的凸起位置和增强的EMI屏蔽效果。

公开(公告)号：US11984379B2

公开(公告)日：2024-05-14

申请号：US17370207

申请日：2021-07-08

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/73 ,  H01L2224/73204

Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

公开(公告)号：US20230361091A1

公开(公告)日：2023-11-09

申请号：US18220501

申请日：2023-07-11

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L25/105 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L21/565 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/81801 ,  H01L2924/182 ,  H01L2224/73204

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US11742296B2

公开(公告)日：2023-08-29

申请号：US17134925

申请日：2020-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US20220399245A1

公开(公告)日：2022-12-15

申请号：US17370207

申请日：2021-07-08

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L21/48

Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.