Invention Application
- Patent Title: SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM
- Patent Title (中): 基板处理方法，基板处理装置和存储介质
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Application No.: US13910249Application Date: 2013-06-05
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Publication No.: US20140080312A1Publication Date: 2014-03-20
- Inventor: Hayato IWAMOTO , Yoshiya HAGIMOTO , Tomoki TETSUKA , Shinichiro SHIMOMURA , Teruomi MINAMI , Hiroki SAKURAI , Hirotaka MARUYAMA , Yosuke KAWABUCHI , Hiroshi TANAKA
- Applicant: Tokyo Electron Limited , Sony Corporation
- Priority: JP2012-130905 20120608
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67
Abstract:
A wafer is held horizontally and rotated by a substrate holding mechanism. An aqueous alkaline solution is supplied to a wafer by a nozzle and caused to flow from a central portion to a peripheral edge portion of the wafer, thereby etching the wafer. An amount of oxygen, which is equal to or more than the amount of oxygen in atmospheric air involved in the aqueous alkaline solution flowing on the wafer, is previously dissolved in the aqueous alkaline solution.
Public/Granted literature
- US09362106B2 Substrate processing method, substrate processing apparatus, and storage medium Public/Granted day:2016-06-07
Information query
IPC分类:
