Invention Application
- Patent Title: 3-DIMENSIONAL NANOPLASMONIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 三维纳米结构及其制造方法
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Application No.: US13898923Application Date: 2013-05-21
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Publication No.: US20140087138A1Publication Date: 2014-03-27
- Inventor: Ji-hyun BAE , Jong-jin PARK , Sang-hun JEON
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0105953 20120924
- Main IPC: G02F1/01
- IPC: G02F1/01 ; C23C14/14 ; C23C14/22 ; C23C14/58 ; C23C16/56

Abstract:
A three-dimensional (3D) nanoplasmonic structure includes a substrate; a plurality of nanorods formed on the substrate; and a plurality of metal nanoparticles formed on surfaces of the substrate and the plurality of nanorods. A method of manufacturing a 3D nanoplasmonic structure includes preparing a substrate; growing a plurality of nanorods on the substrate; forming a metal layer on surfaces of the plurality of nanorods; and dewetting the metal layer into particles by heat-treating the metal layer
Information query