发明申请
US20140093723A1 SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND HEAT-RELEASING MODULE
审中-公开
基板，其制造方法，热释放基板和热释放模块
- 专利标题： SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND HEAT-RELEASING MODULE
- 专利标题（中）： 基板，其制造方法，热释放基板和热释放模块
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申请号： US14122655申请日： 2012-05-23
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公开(公告)号： US20140093723A1公开(公告)日： 2014-04-03
- 发明人: Masaki Takeuchi , Yoshitsugu Matsuura , Kazuhito Obata
- 申请人： Masaki Takeuchi , Yoshitsugu Matsuura , Kazuhito Obata
- 优先权： JP2011-119555 20110527
- 国际申请： PCT/JP2012/063227 WO 20120523
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; F28F21/08
摘要：
The invention provides a substrate, including: a metal foil; a polyimide resin layer having an average thickness of from 3 μm to 25 μm, the polyimide resin layer being disposed on a surface of the metal foil having an arithmetic average roughness (Ra) of 0.3 μm or less and a maximum roughness (Rmax) of 2.0 μm or less; and an adhesive layer having an average thickness of from 5 μm to 25 μm, the adhesive layer being disposed on the polyimide resin layer.
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