公开(公告)号：US20140093723A1

公开(公告)日：2014-04-03

申请号：US14122655

申请日：2012-05-23

申请人： Masaki Takeuchi ,  Yoshitsugu Matsuura ,  Kazuhito Obata

发明人： Masaki Takeuchi ,  Yoshitsugu Matsuura ,  Kazuhito Obata

IPC分类号： H05K1/03 ,  F28F21/08

CPC分类号： H05K1/036 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2307/30 ,  F28F21/08 ,  H01L23/142 ,  H01L2924/0002 ,  H05K1/0257 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/382 ,  H05K3/386 ,  Y10T428/265 ,  H01L2924/00

摘要： The invention provides a substrate, including: a metal foil; a polyimide resin layer having an average thickness of from 3 μm to 25 μm, the polyimide resin layer being disposed on a surface of the metal foil having an arithmetic average roughness (Ra) of 0.3 μm or less and a maximum roughness (Rmax) of 2.0 μm or less; and an adhesive layer having an average thickness of from 5 μm to 25 μm, the adhesive layer being disposed on the polyimide resin layer.

摘要翻译： 本发明提供了一种基板，包括：金属箔; 平均厚度为3μm至25μm的聚酰亚胺树脂层，所述聚酰亚胺树脂层设置在金属箔的表面上，其算术平均粗糙度（Ra）为0.3μm以下，最大粗糙度（Rmax）为 2.0μm以下; 以及平均厚度为5μm〜25μm的粘合剂层，所述粘合剂层设置在所述聚酰亚胺树脂层上。

公开(公告)号：US20100196703A1

公开(公告)日：2010-08-05

申请号：US12597197

申请日：2008-04-24

申请人： Yoshitsugu Matsuura ,  Kazuhito Obata ,  Masaki Takeuchi

发明人： Yoshitsugu Matsuura ,  Kazuhito Obata ,  Masaki Takeuchi

IPC分类号： C09J7/02 ,  B32B15/08

CPC分类号： H05K3/4655 ,  C08G59/4085 ,  C09J7/29 ,  C09J163/00 ,  C09J2467/006 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/28 ,  Y10T428/2804

摘要： An adhesive sheet comprising a base 3 and an adhesive resin layer 4 formed on one side of the base 3, wherein the adhesive resin layer 4 has a glass transition temperature of 170-200° C. and a post-curing elastic modulus of 100-500 MPa.

摘要翻译： 一种粘合片，其包括基底3和形成在基底3的一侧上的粘合树脂层4，其中粘合性树脂层4的玻璃化转变温度为170-200℃，后固化弹性模量为100〜 500 MPa。

公开(公告)号：US20070277375A1

公开(公告)日：2007-12-06

申请号：US11630651

申请日：2005-06-22

申请人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

发明人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

IPC分类号： H05K3/10

CPC分类号： B32B27/04 ,  B29K2105/0872 ,  H05K1/0366 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/53883

摘要： A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.

摘要翻译： 根据本发明的印刷线路板预浸料是通过用热固性树脂组合物浸渍干燥基材而获得的印刷线路板预浸料，当其弯曲90°时，基材中不会发生裂纹。

公开(公告)号：US08501279B2

公开(公告)日：2013-08-06

申请号：US12091519

申请日：2006-10-19

申请人： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshitsugu Matsuura

发明人： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshitsugu Matsuura

IPC分类号： B32B3/10 ,  B32B15/09 ,  B05D3/02 ,  B05D3/10

CPC分类号： H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/163 ,  Y10T428/24917 ,  Y10T428/261 ,  Y10T428/27

摘要： A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

摘要翻译： 一种制造具有一个或多个层叠体的柔性层叠片的方法，每个层叠体均设置有形成在树脂膜的一侧上的金属箔，该方法包括涂布步骤，其中将包含聚酰胺酸和溶剂的清漆涂覆到 金属箔以形成涂膜，保持在金属箔上形成的涂膜的保持步骤，其中除去清漆中的至少一部分溶剂以形成由树脂构成的层的干燥步骤 组合物和树脂膜形成步骤，其中由树脂组合物组成的层被加热以形成含有聚酰亚胺树脂的树脂膜。 基于树脂膜中的金属元素含量的目标，调整从涂布步骤到树脂成膜步骤的每个步骤的条件。

公开(公告)号：US20120244275A1

公开(公告)日：2012-09-27

申请号：US13431633

申请日：2012-03-27

申请人： Masahiko SUZUKI ,  Kazuhito OBATA ,  Katsuyuki MASUDA ,  Kenichi TOMIOKA ,  Masaki TAKEUCHI ,  Sumio YOSHIDA ,  Hirokazu SUZUKI ,  Yoshitsugu MATSUURA

发明人： Masahiko SUZUKI ,  Kazuhito OBATA ,  Katsuyuki MASUDA ,  Kenichi TOMIOKA ,  Masaki TAKEUCHI ,  Sumio YOSHIDA ,  Hirokazu SUZUKI ,  Yoshitsugu MATSUURA

IPC分类号： B05D5/12

CPC分类号： H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/163 ,  Y10T428/24917 ,  Y10T428/261 ,  Y10T428/27

摘要： A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film. The process includes coating a varnish containing a polyamic acid and a solvent onto the metal foil, holding the coated film, drying in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and forming the resin in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating up to the resin film-forming are adjusted based on a target for the content of metal elements in the resin film.

摘要翻译： 一种具有一个或多个层叠体的柔性层压片的制造方法，每个层叠体在树脂膜的一面上形成有金属箔。 该方法包括将含有聚酰胺酸和溶剂的清漆涂覆到金属箔上，保持涂膜，干燥，除去清漆中的至少一部分溶剂以形成由树脂组合物组成的层，并形成 加热由树脂组合物构成的层的树脂，形成含有聚酰亚胺树脂的树脂膜。 基于树脂膜中的金属元素含量的目标调整从涂覆到树脂成膜的各步骤的条件。

公开(公告)号：US07947332B2

公开(公告)日：2011-05-24

申请号：US11630651

申请日：2005-06-22

申请人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

发明人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

IPC分类号： B05D3/12

CPC分类号： B32B27/04 ,  B29K2105/0872 ,  H05K1/0366 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/53883

摘要： A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.

摘要翻译： 根据本发明的印刷线路板预浸料是通过用热固性树脂组合物浸渍干燥基材而获得的印刷线路板预浸料，当其弯曲90°时，基材中不会发生裂纹。