利索-全球专利检索

  1. 登录
  2. 注册
发明申请
US20140097006A1 ETCHANT COMPOSITION, METAL WIRING, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE 审中-公开
蚀刻组合物，金属接线以及制造显示基板的方法

ETCHANT COMPOSITION, METAL WIRING, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE
摘要：
A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weight of nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water
摘要（中）：

可用于蚀刻铜基布线层的湿蚀刻组合物包括约40重量％至约60重量％的磷酸，约1重量％至约10重量％的硝酸，约3重量％ 至约15重量％的乙酸，约0.01重量％至约0.1重量％的铜离子化合物，约1重量％至约10重量％的硝酸盐之间，介于约 1重量％至约10重量％的乙酸盐，剩余的水

信息查询
Global Dossier Espacenet
0/0