Invention Application
US20140098457A1 DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED USING THE SAME
审中-公开
使用其制造的电介质组合物和多层陶瓷电子元件
- Patent Title: DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED USING THE SAME
- Patent Title (中): 使用其制造的电介质组合物和多层陶瓷电子元件
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Application No.: US13842046Application Date: 2013-03-15
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Publication No.: US20140098457A1Publication Date: 2014-04-10
- Inventor: Sung Hyung KANG , Jae Sung PARK , Sang Huk KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0110782 20121005
- Main IPC: C04B35/468
- IPC: C04B35/468 ; H01G4/008

Abstract:
There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectric composition including a dielectric grain having a perovskite structure represented by ABO3, wherein the dielectric grain has a core-shell structure in which a content of an additive in a shell is 15% or less, based on an average content of the additive distributed throughout the dielectric grain, so that the multilayer ceramic electronic component manufactured using the dielectric composition can have excellent reliability and secure a high dielectric constant.
Information query
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