Abstract:
There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode.
Abstract:
There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectric composition including a dielectric grain having a perovskite structure represented by ABO3, wherein the dielectric grain has a core-shell structure in which a content of an additive in a shell is 15% or less, based on an average content of the additive distributed throughout the dielectric grain, so that the multilayer ceramic electronic component manufactured using the dielectric composition can have excellent reliability and secure a high dielectric constant.
Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 μm or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td≦0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability.
Abstract:
A dielectric composition to be sintered at low temperature may include BaTiO3 as a major component; and (1-x)Li2O-xCuO as a minor component, wherein x is 0.1 to 0.9, and the minor component is contained in a content of 0.1 mol % to 2.0 mol % based on 100 mol % of the major component.
Abstract:
There are provided a dielectric ceramic composition and a multilayer ceramic capacitor including the same. The dielectric ceramic composition according to embodiments of the present disclosure includes a base powder represented by xSrTiO3-(1−x)BiMO3 (M includes Mg and Ti) containing a first main component represented by SrTiO3 and a second main component represented by BiMO3, wherein x satisfies 0.5≦x≦0.9.
Abstract:
There is provided a multilayer ceramic electronic component including a ceramic body satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, a plurality of first and second internal electrodes having the respective dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to be extended from the both end surfaces to both upper and lower main surfaces of the ceramic body, wherein, the ceramic body is formed such that a cross-section thereof in a width-thickness direction has a trapezoidal shape in which two sides among four sides are inclined in one direction, and when an angle formed by a bottom side and a side connected thereto is defined as θ, 86°≦θ
Abstract:
There is provided a dielectric composition for low-temperature sintering including BaTiO3 as a main ingredient, and xB2O3-(1-x)BaOas an accessory ingredient, wherein x ranges from 0.25 to 0.8, and the content of the accessory ingredient ranges from 0.1 to 2.00 mol %, based on 100 mol % of the main ingredient.
Abstract:
A multilayer ceramic electronic component includes a ceramic main body including dielectric layers and satisfying T/W>1.0 when W and T are width and thickness, respectively; and first and second internal electrodes stacked in the ceramic main body and facing each other with the dielectric layer interposed therebetween, the ceramic main body including an active layer corresponding to a capacitance forming portion contributing to capacitance formation and a cover layer corresponding to a non-capacitance forming portion provided on at least one of uppermost and lowermost surfaces of the active layer, and when the active layer is divided into three regions in a direction in which the first and second internal electrodes are stacked, an average width of internal electrodes in a central region of the three regions is Wa, and an average width of internal electrodes in upper and lower regions of the three regions is Wb, 0.920≦Wb/Wa≦0.998 is satisfied.
Abstract:
There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; and first and second inner electrode layers formed within the ceramic body, wherein, when a thickness of the dielectric layer is defined as td and a maximum thickness and a minimum thickness of the first or second inner electrode layer are defined as tmax and tmin, respectively, td≦0.6 μm and (tmax−tmin)/td
Abstract:
There is provided a multilayer ceramic electronic component, including: a multilayer body having a dielectric layer; and a plurality of internal electrode layers provided in the multilayer body, and having ends exposed to at least one face of the multilayer body, wherein, a ratio of T2 to T1 (T2/T1) ranges from 0.70 to 0.95, when T1 represents a thickness of a capacity formation portion formed by overlapping the plurality of internal electrode layers and T2 represents a distance between ends of outermost internal electrodes arranged on one face of the multilayer body to which the ends of the internal electrodes are exposed, and a thickness D1 of the multilayer body, in which the capacity formation portion is formed, is greater than a thickness D2 of a first side of the multilayer body to which the ends of the internal electrodes are exposed.