Invention Application
- Patent Title: SHEET OF SEMICONDUCTING MATERIAL, SYSTEM FOR FORMING SAME, AND METHOD OF FORMING SAME
- Patent Title (中): 半导体材料,其形成系统及其形成方法
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Application No.: US13841995Application Date: 2013-03-15
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Publication No.: US20140099232A1Publication Date: 2014-04-10
- Inventor: Samir Biswas , Douglass Lane Blanding , Glen Bennett Cook , Prantik Mazumder , Kamal Kishore Soni , Balram Suman
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Main IPC: H01L33/02
- IPC: H01L33/02 ; H01L21/02

Abstract:
A method of forming a sheet of semiconductor material utilizes a system. The system comprises a first convex member extending along a first axis and capable of rotating about the first axis and a second convex member spaced from the first convex member and extending along a second axis and capable of rotating about the second axis. The first and second convex members define a nip gap therebetween. The method comprises applying a melt of the semiconductor material on an external surface of at least one of the first and second convex members to form a deposit on the external surface of at least one of the first and second convex members. The method further comprises rotating the first and second convex members in a direction opposite one another to allow for the deposit to pass through the nip gap, thereby forming the sheet of semiconductor material.
Information query
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