发明申请
- 专利标题： Wafer-Level Package and Method for Production Thereof
- 专利标题（中）： 晶圆级封装及其生产方法
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申请号： US14007074申请日： 2012-03-28
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公开(公告)号： US20140111062A1公开(公告)日： 2014-04-24
- 发明人: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
- 申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
- 申请人地址： DE Muenchen
- 专利权人： EPCOS AG
- 当前专利权人： EPCOS AG
- 当前专利权人地址： DE Muenchen
- 优先权： DE102011016554.1 20110408
- 国际申请： PCT/EP2012/055559 WO 20120328
- 主分类号： H01L41/053
- IPC分类号： H01L41/053 ; H01L41/25
摘要：
A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.
公开/授权文献
- US09647196B2 Wafer-level package and method for production thereof 公开/授权日：2017-05-09
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