发明申请
- 专利标题： WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 接线板及其制造方法
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申请号： US13745047申请日： 2013-01-18
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公开(公告)号： US20140116753A1公开(公告)日： 2014-05-01
- 发明人: Han Ul LEE , Yong Sam LEE , Suk Hwan AHN
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2012-0119644 20121026
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K1/02
摘要：
There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers.
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