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公开(公告)号：US20140116753A1
公开(公告)日：2014-05-01
申请号：US13745047
申请日：2013-01-18
发明人： Han Ul LEE , Yong Sam LEE , Suk Hwan AHN
CPC分类号： H05K1/09 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H05K1/0306 , H05K3/108 , H05K2201/0338 , H05K2203/1476
摘要： There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers.
摘要翻译： 提供一种布线板，其中构成布线图案的镀层形成为具有均匀的厚度，以及制造布线板的方法。 布线板包括绝缘层; 以及形成在所述绝缘层上的布线图案，其中，通过层叠两层以上的镀层来形成所述布线图案中的至少一个。
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公开(公告)号：US20190013276A1
公开(公告)日：2019-01-10
申请号：US15802131
申请日：2017-11-02
发明人： Han Ul LEE , Jin Su KIM , Young Gwan KO
IPC分类号： H01L23/538 , H01L23/31 , H01L23/00 , H01L21/48 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/56 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2221/68345 , H01L2224/16227 , H01L2224/214 , H01L2224/73204 , H01L2224/81005 , H01L2924/15311 , H01L2924/18161
摘要： A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.
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公开(公告)号：US20190013256A1
公开(公告)日：2019-01-10
申请号：US15966723
申请日：2018-04-30
发明人： Han Ul LEE , Jin Su KIM , Young Gwan KO
IPC分类号： H01L23/31 , H01L23/00 , H01L23/498 , H01L23/538 , H01L21/3105 , H01L21/56 , H01L21/48 , H01L21/683 , H01L25/18
CPC分类号： H01L23/3128 , H01L21/31058 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3135 , H01L23/49816 , H01L23/5383 , H01L23/5386 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/82 , H01L25/0655 , H01L25/18 , H01L2221/68345 , H01L2224/02377 , H01L2224/024 , H01L2224/0401 , H01L2224/05008 , H01L2224/0501 , H01L2224/05124 , H01L2224/05569 , H01L2224/05624 , H01L2224/06133 , H01L2224/11334 , H01L2224/13024 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/143 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/00014
摘要： A semiconductor device includes: a chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the chip; a connection member disposed on the active surface of the chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member; and an under bump metallurgy (UBM) layer at least partially embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad partially embedded in the passivation layer and a UVM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other. A portion of a side surface of the UBM pad is exposed through an opening formed in the passivation layer and the opening surrounds the UBM pad.
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