Invention Application
- Patent Title: STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): STUD BUMP结构及其制造方法
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Application No.: US13762132Application Date: 2013-02-07
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Publication No.: US20140124920A1Publication Date: 2014-05-08
- Inventor: Tung-Han CHUANG , Hsing-Hua TSAI , Jun-Der LEE
- Applicant: WIRE TECHNOLOGY CO., LTD.
- Applicant Address: TW Taichung City
- Assignee: WIRE TECHNOLOGY CO., LTD.
- Current Assignee: WIRE TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Taichung City
- Priority: TW101141253 20121107
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498
Abstract:
A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.
Public/Granted literature
- US09490147B2 Stud bump structure and method for manufacturing the same Public/Granted day:2016-11-08
Information query
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