公开(公告)号：US20130233594A1

公开(公告)日：2013-09-12

申请号：US13774511

申请日：2013-02-22

Applicant: Jun-Der Lee ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua Tsai ,  Tung-Han Chuang

IPC: H01L23/00 ,  H01B13/30

CPC classification number: H01L24/45 ,  H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48507 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00 ,  H01L2924/01079 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-gold-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 金 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US20140124920A1

公开(公告)日：2014-05-08

申请号：US13762132

申请日：2013-02-07

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han CHUANG ,  Hsing-Hua TSAI ,  Jun-Der LEE

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Abstract translation: 提供了一种螺柱凸块结构及其制造方法。 所述柱状凸块结构包括基板和设置在所述基板上的第一银合金凸块凸块，其中所述第一银合金凸块具有Ag：Au：Pd = 60-99.98：0.01-30：0.01-10的重量百分比 。

公开(公告)号：US20130233593A1

公开(公告)日：2013-09-12

申请号：US13774451

申请日：2013-02-22

Applicant: Jun-Der LEE ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: H01B1/02 ,  H01B13/30

CPC classification number: H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85206 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。