Invention Application
US20140131844A1 System and Method for an Electronic Package with a Fail-Open Mechanism
有权
具有故障开放机制的电子封装的系统和方法
- Patent Title: System and Method for an Electronic Package with a Fail-Open Mechanism
- Patent Title (中): 具有故障开放机制的电子封装的系统和方法
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Application No.: US13678421Application Date: 2012-11-15
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Publication No.: US20140131844A1Publication Date: 2014-05-15
- Inventor: Carlo Baterna Marbella , Ganesh Vetrivel Periasamy , Woon Yik Yong , Kok Kiat Koo , Christian Arndt , Edward Myers
- Applicant: INFINEON TECHNOLOGIES AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/495
Abstract:
A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on the chip carrier and an encapsulant encapsulating the chip and the chip carrier. The semiconductor package further including a pin protruding from the encapsulant and a fail open mechanism disposed on the encapsulant and connected to the pin, wherein the fail open mechanism is configured to be disconnected from the pin if a temperature exceeds a pre-determined temperature.
Public/Granted literature
- US09082737B2 System and method for an electronic package with a fail-open mechanism Public/Granted day:2015-07-14
Information query
IPC分类:
