Invention Application
US20140138680A1 Semiconductor Device, Electronic Device, and Method of Manufacturing Semiconductor Device
审中-公开
半导体器件，电子器件和半导体器件的制造方法
- Patent Title: Semiconductor Device, Electronic Device, and Method of Manufacturing Semiconductor Device
- Patent Title (中): 半导体器件，电子器件和半导体器件的制造方法
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Application No.: US14164476Application Date: 2014-01-27
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Publication No.: US20140138680A1Publication Date: 2014-05-22
- Inventor: Toshiyuki Isa , Masafumi Morisue , Ikuko Kawamata
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Priority: JP2005-022248 20050128
- Main IPC: H01L29/786
- IPC: H01L29/786
Abstract:
To provide a semiconductor device and a display device which can be manufactured through a simplified process and the manufacturing technique. Another object is to provide a technique by which a pattern of wirings or the like which is partially constitutes a semiconductor device or a display device can be formed with a desired shape with controllability.
Public/Granted literature
- US09356152B2 Semiconductor device, electronic device, and method of manufacturing semiconductor device Public/Granted day:2016-05-31
Information query
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