Invention Application
- Patent Title: CAPACITOR STRUCTURE FOR WIDEBAND RESONANCE SUPPRESSION IN POWER DELIVERY NETWORKS
- Patent Title (中): 电力传输网络中宽带谐振抑制的电容结构
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Application No.: US13684072Application Date: 2012-11-21
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Publication No.: US20140139969A1Publication Date: 2014-05-22
- Inventor: Kyu-Pyung Hwang , Youngsville K. Song , Changhan Yun , Dong Wook Kim
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Main IPC: H01G4/002
- IPC: H01G4/002

Abstract:
Some novel features pertain to a capacitor structure that includes a first conductive layer, a second conductive layer and a non-conductive layer. The first conductive layer has a first overlapping portion and a second overlapping portion. The second conductive layer has a third overlapping portion, a fourth overlapping portion, and a non-overlapping portion. The third overlapping portion overlaps with the first overlapping portion of the first conductive layer. The fourth overlapping portion overlaps with the second overlapping portion of the first conductive layer. The non-overlapping portion is free of any overlap (e.g., vertical overlap) with the first conductive layer. The non-conductive layer separates the first and second conductive layers. The non-conductive layer electrically insulates the third overlapping portion and the fourth overlapping portion from the first conductive layer.
Public/Granted literature
- US09837209B2 Capacitor structure for wideband resonance suppression in power delivery networks Public/Granted day:2017-12-05
Information query