发明申请
- 专利标题： LIGHT-EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
- 专利标题（中）： 发光二极管封装及其制造方法
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申请号： US13825937申请日： 2010-12-03
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公开(公告)号： US20140145633A1公开(公告)日： 2014-05-29
- 发明人: Won Cheol Seo , Yeo Jin Yoon
- 申请人： Won Cheol Seo , Yeo Jin Yoon
- 申请人地址： KR Ansan-si
- 专利权人： SEOUL OPTO DEVICE CO., LTD.
- 当前专利权人： SEOUL OPTO DEVICE CO., LTD.
- 当前专利权人地址： KR Ansan-si
- 优先权： KR10-2010-0092849 20100924
- 国际申请： PCT/KR10/08627 WO 20101203
- 主分类号： H01L33/38
- IPC分类号： H01L33/38 ; H01L33/08
摘要：
A Light Emitting Diode (LED) package and a method of manufacturing the same. The LED package includes a substrate. The substrate defines therein a cavity having a tapered shape, a stepped portion formed on the upper end of the cavity, and a through hole formed in the bottom of the cavity. A conductive film fills the through-hole and is formed on the bottom and the side surfaces of the cavity. An LED has a fluorescent layer thereon, and is flip-chip bonded onto the conductive film. An encapsulant encapsulates the cavity. A Zener diode or a rectifier is provided on the silicon substrate.
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