Invention Application
- Patent Title: THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION
- Patent Title (中): 热接口元件及其制备方法
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Application No.: US13691138Application Date: 2012-11-30
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Publication No.: US20140151009A1Publication Date: 2014-06-05
- Inventor: Raj Bahadur , David Mulford Shaddock
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Main IPC: F28F21/08
- IPC: F28F21/08
Abstract:
An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate.
Information query
