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1.发明申请METHOD AND SYSTEM FOR ULTRA MINIATURIZED PACKAGES FOR TRANSIENT VOLTAGE SUPPRESSORS 有权用于瞬态电压抑制器的超小型封装的方法和系统公开(公告)号：US20150002976A1
公开(公告)日：2015-01-01
申请号：US14486138
申请日：2014-09-15
CPC分类号： H02H1/04 , H01L21/50 , H01L21/8213 , H01L21/8252 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/96 , H01L27/0255 , H01L27/0605 , H01L27/0814 , H01L29/0661 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L29/45 , H01L29/861 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13109 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/24137 , H01L2224/81203 , H01L2224/81815 , H01L2224/81825 , H01L2924/10272 , H01L2924/12036 , H01L2924/12041 , H01L2924/15192 , H01L2924/3025 , H02H3/20 , H01L2924/0105 , H01L2924/00
摘要： A high temperature electronic system includes an electronics unit configured for exposure to an environment having a temperature greater than approximately 150.0° C. The remote electronics unit includes a transient voltage suppressor (TVS) assembly coupled in operative relationship with at least some electronic components of the electronics unit. The TVS assembly includes at least one TVS device comprising at least one of a punch-through wide band-gap semiconductor TVS die and an avalanche breakdown wide band-gap semiconductor TVS die encapsulated in a flip-chip package at least partially surrounding the die, and coupled to first and second electrodes exposed to a single side of the encapsulation.
摘要翻译： 高温电子系统包括被配置为暴露于温度大于约150.0℃的环境的电子单元。远程电子单元包括瞬态电压抑制器（TVS）组件，其与至少一些电子部件的操作关系耦合 电子单元。 TVS组件包括至少一个TVS装置，其包括穿透宽带隙半导体TVS管芯和封装在至少部分围绕管芯的倒装芯片封装的雪崩击穿宽带隙半导体TVS管芯中的至少一个， 并且耦合到暴露于封装的单侧的第一和第二电极。
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公开(公告)号：US20140151009A1
公开(公告)日：2014-06-05
申请号：US13691138
申请日：2012-11-30
IPC分类号： F28F21/08
CPC分类号： F28F21/089 , C23C14/16 , C23C14/225 , F28F13/00 , F28F21/00 , F28F2013/005 , Y10T29/4935
摘要： An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate.
摘要翻译： 公开了一种组装制品的制品和方法。 组装方法包括在热源和散热器之间定位预制的热界面元件。 预制的热界面元件包括铟衬底和设置在铟衬底上的多个纳米脉冲。
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公开(公告)号：US20230020337A1
公开(公告)日：2023-01-19
申请号：US17949325
申请日：2022-09-21
发明人： Cheng-Po Chen , Reza Ghandi , David Richard Esler , David Mulford Shaddock , Emad Andarawis Andarawis , Liang Yin
IPC分类号： H01L21/768 , H01L23/31 , H01L23/00 , H01L23/532 , H01L21/02
摘要： An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.
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公开(公告)号：US20180328357A1
公开(公告)日：2018-11-15
申请号：US15595685
申请日：2017-05-15
CPC分类号： F04B51/00 , E21B43/126 , E21B47/022 , E21B47/06 , F04B47/02 , F04B2201/121 , F04B2207/02 , F04B2207/03
摘要： A downhole dynamometer for a rod pumping unit is provided. The downhole dynamometer includes a shell within which a plurality of sensors, a non-transitory memory, and a dynamometer controller are located. The shell is configured to be coupled to a sucker rod string of the rod pumping unit and disposed in a well opposite a wellhead of the well. The plurality of sensors is configured to measure downhole accelerations of the sucker rod string and to measure a downhole load on the sucker rod string. The dynamometer controller is coupled to the plurality of sensors and the non-transitory memory. The dynamometer controller is configured to periodically collect measurements from the plurality of sensors and store the measurements in the non-transitory memory.
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5.发明授权公开(公告)号：US09947647B2
公开(公告)日：2018-04-17
申请号：US14102632
申请日：2013-12-11
发明人： Avinash Srikrishnan Kashyap , Peter Micah Sandvik , Mark Gerard Roberto , David Mulford Shaddock , Joe Walter Kirstein
CPC分类号： H01L27/0248 , H02H9/041 , Y10T29/49117
摘要： A method of fabricating an overvoltage protection device and an over-voltage circuit protection device are provided. The over-voltage circuit protection device includes a plurality of transient voltage suppression (TVS) devices coupled in electrical parallel.
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公开(公告)号：US09252138B2
公开(公告)日：2016-02-02
申请号：US14287237
申请日：2014-05-27
发明人： Gamal Refai-Ahmed , David Mulford Shaddock , Arun Virupaksha Gowda , John Anthony Vogel , Christian Giovanniello
IPC分类号： H01L33/02 , H01L25/16 , H01L25/00 , H01L33/62 , H01L33/64 , H01L33/54 , H01S5/022 , H01S5/024 , H01L23/538
CPC分类号： H01L23/5386 , H01L23/49811 , H01L33/62 , H01L2924/0002 , H01S5/02256 , H05K3/32 , H05K2201/0311 , H05K2201/10674 , H01L2924/00
摘要： An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.
摘要翻译： 提供一种具有半导体集成电路和多个互连部件的电子封装组件。 多个互连部件可操作地耦合到半导体集成电路。 此外，一个或多个互连部件包括具有第一表面和第二表面的一个或多个支撑元件，以及具有第一端和第二端的一个或多个弹簧元件，并且其中一个或多个弹簧元件的第一端连接 到相应的支撑元件的第一表面或第二表面。
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7.发明授权Method and system for ultra miniaturized packages for transient voltage suppressors 有权用于瞬态电压抑制器的超小尺寸封装的方法和系统公开(公告)号：US09130365B2
公开(公告)日：2015-09-08
申请号：US14486138
申请日：2014-09-15
IPC分类号： H01L29/66 , H01L21/332 , H02H1/04 , H01L21/50 , H01L29/861 , H01L21/82 , H01L27/06 , H01L27/08 , H01L27/02 , H01L23/00 , H02H3/20 , H01L29/45 , H01L29/06 , H01L29/16 , H01L29/20 , H01L21/8252
CPC分类号： H02H1/04 , H01L21/50 , H01L21/8213 , H01L21/8252 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/96 , H01L27/0255 , H01L27/0605 , H01L27/0814 , H01L29/0661 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L29/45 , H01L29/861 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13109 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/24137 , H01L2224/81203 , H01L2224/81815 , H01L2224/81825 , H01L2924/10272 , H01L2924/12036 , H01L2924/12041 , H01L2924/15192 , H01L2924/3025 , H02H3/20 , H01L2924/0105 , H01L2924/00
摘要： A high temperature electronic system includes an electronics unit configured for exposure to an environment having a temperature greater than approximately 150.0° C. The remote electronics unit includes a transient voltage suppressor (TVS) assembly coupled in operative relationship with at least some electronic components of the electronics unit. The TVS assembly includes at least one TVS device comprising at least one of a punch-through wide band-gap semiconductor TVS die and an avalanche breakdown wide band-gap semiconductor TVS die encapsulated in a flip-chip package at least partially surrounding the die, and coupled to first and second electrodes exposed to a single side of the encapsulation.
摘要翻译： 高温电子系统包括被配置为暴露于温度大于约150.0℃的环境的电子单元。远程电子单元包括瞬态电压抑制器（TVS）组件，其与至少一些电子部件的操作关系耦合 电子单元。 TVS组件包括至少一个TVS装置，其包括穿透宽带隙半导体TVS管芯和封装在至少部分围绕管芯的倒装芯片封装的雪崩击穿宽带隙半导体TVS管芯中的至少一个， 并且耦合到暴露于封装的单侧的第一和第二电极。
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8.发明申请METHOD AND SYSTEM FOR OVER-VOLTAGE PROTECTION USING TRANSIENT VOLTAGE SUPPRESSION DEVICES 有权使用瞬态电压抑制装置进行过电压保护的方法和系统公开(公告)号：US20150162743A1
公开(公告)日：2015-06-11
申请号：US14102632
申请日：2013-12-11
发明人： Avinash Srikrishnan Kashyap , Peter Micah Sandvik , Mark Gerard Roberto , David Mulford Shaddock , Joe Walter Kirstein
IPC分类号： H02H9/04
CPC分类号： H01L27/0248 , H02H9/041 , Y10T29/49117
摘要： A method of fabricating an overvoltage protection device and an over-voltage circuit protection device are provided. The over-voltage circuit protection device includes a plurality of transient voltage suppression (TVS) devices coupled in electrical parallel.
摘要翻译： 提供了一种制造过电压保护装置和过电压电路保护装置的方法。 过电压电路保护装置包括并联耦合的多个瞬态电压抑制（TVS）装置。
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公开(公告)号：US20220037201A1
公开(公告)日：2022-02-03
申请号：US16983380
申请日：2020-08-03
发明人： Cheng-Po Chen , Reza Ghandi , David Richard Esler , David Mulford Shaddock , Emad Andarawis Andarawis , Liang Yin
IPC分类号： H01L21/768 , H01L21/02 , H01L23/31 , H01L23/532 , H01L23/00
摘要： An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.
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公开(公告)号：USRE48015E1
公开(公告)日：2020-05-26
申请号：US15886478
申请日：2018-02-01
发明人： Gamal Refai-Ahmed , David Mulford Shaddock , Arun Virupaksha Gowda , John Anthony Vogel , Christian Michael Giovanniello
IPC分类号： H01L33/02 , H01L25/16 , H01L25/00 , H01L33/62 , H01L33/64 , H01L33/54 , H01S5/022 , H01S5/024 , H01L23/538
摘要： An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.
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