发明申请
- 专利标题: OPTICAL COUPLING MODULE FOR SILICON PHOTONICS CHIP
- 专利标题(中): 硅光电芯片光耦合模块
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申请号: US14081197申请日: 2013-11-15
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公开(公告)号: US20140153873A1公开(公告)日: 2014-06-05
- 发明人: Sae-Kyoung KANG , Sang-Soo LEE
- 申请人: Electronics and Telecommunications Research Institute
- 申请人地址: KR Daejeon-si
- 专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人地址: KR Daejeon-si
- 优先权: KR10-2012-0139064 20121203
- 主分类号: G02B6/34
- IPC分类号: G02B6/34
摘要:
An optical coupling module for a silicon photonics chip in which a grating is formed on an optical waveguide, and a material having an intermediate refractive index between refractive indexes of a core and a cladding for side surface optical coupling of the silicon photonics chip is provided. The optical coupling module which is optically coupled with an internal/external optical fiber comprises a core transmitting light, and a cladding covering the core and holding the light in the core through total internal reflection, wherein a grating is formed at one end of the core, and a refractive element is formed between the one end of the core and the cladding, has an intermediate refractive index between the refractive indexes of the core and the cladding, and is optically coupled with the internal/external optical fiber.
公开/授权文献
- US09042691B2 Optical coupling module for silicon photonics chip 公开/授权日:2015-05-26
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