发明申请
US20140174660A1 PLASMA PROCESSING APPARATUS 有权
等离子体加工设备

  • 专利标题: PLASMA PROCESSING APPARATUS
  • 专利标题(中): 等离子体加工设备
  • 申请号: US14127286
    申请日: 2012-06-29
  • 公开(公告)号: US20140174660A1
    公开(公告)日: 2014-06-26
  • 发明人: Masahide Iwasaki
  • 申请人: Masahide Iwasaki
  • 申请人地址: JP Tokyo
  • 专利权人: TOKYO ELECTRON LIMITED
  • 当前专利权人: TOKYO ELECTRON LIMITED
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2011-145476 20110630
  • 国际申请: PCT/JP2012/004230 WO 20120629
  • 主分类号: H01J37/32
  • IPC分类号: H01J37/32
PLASMA PROCESSING APPARATUS
摘要:
The microwave plasma processing apparatus includes a power feeding rod that applies high frequency wave for RF bias, the upper end of which is connected to a susceptor, and the lower end of which is connected to a high frequency output terminal of a matcher in a matching unit; a cylindrical external conductor that encloses around the power feeding rod serving as an internal conductor; and a coaxial line. The coaxial line is installed with a choke mechanism configured to block undesired microwave that enters the line from a plasma producing space in a chamber, and leakage of the microwave to an RF feeding line is prevented in the middle of the line, thereby suppressing the microwave leakage.
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