发明申请
- 专利标题: PLASMA PROCESSING APPARATUS
- 专利标题(中): 等离子体加工设备
-
申请号: US14127286申请日: 2012-06-29
-
公开(公告)号: US20140174660A1公开(公告)日: 2014-06-26
- 发明人: Masahide Iwasaki
- 申请人: Masahide Iwasaki
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2011-145476 20110630
- 国际申请: PCT/JP2012/004230 WO 20120629
- 主分类号: H01J37/32
- IPC分类号: H01J37/32
摘要:
The microwave plasma processing apparatus includes a power feeding rod that applies high frequency wave for RF bias, the upper end of which is connected to a susceptor, and the lower end of which is connected to a high frequency output terminal of a matcher in a matching unit; a cylindrical external conductor that encloses around the power feeding rod serving as an internal conductor; and a coaxial line. The coaxial line is installed with a choke mechanism configured to block undesired microwave that enters the line from a plasma producing space in a chamber, and leakage of the microwave to an RF feeding line is prevented in the middle of the line, thereby suppressing the microwave leakage.
公开/授权文献
- US09691591B2 Plasma processing apparatus 公开/授权日:2017-06-27
信息查询