Invention Application
- Patent Title: CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 芯片结合结构及其制造方法
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Application No.: US13911075Application Date: 2013-06-06
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Publication No.: US20140175655A1Publication Date: 2014-06-26
- Inventor: Jui-Chin Chen , Cha-Hsin Lin , Tzu-Kun Ku
- Applicant: Industrial Technology Research Institute
- Priority: TW101149286 20121222
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A chip bonding structure at least includes a first substrate, a second substrate opposite to the first substrate, and a copper bonding structure sandwiched in between the first and the second substrates. A Cu—Cu bonding interface is within the copper bonding structure and is characterized with combinations of protrusions and recesses, and the copper crystallization orientation at one side of the Cu—Cu bonding interface is different from that at another side.
Information query
IPC分类:
