发明申请
- 专利标题: BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- 专利标题(中): 不包括建筑层包,包括一个释放层
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申请号: US13725104申请日: 2012-12-21
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公开(公告)号: US20140177193A1公开(公告)日: 2014-06-26
- 发明人: Liwen Jin , Dilan Seneviratne
- 申请人: Liwen Jin , Dilan Seneviratne
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K13/00
摘要:
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.
公开/授权文献
- US09320149B2 Bumpless build-up layer package including a release layer 公开/授权日:2016-04-19