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公开(公告)号：US09451696B2
公开(公告)日：2016-09-20
申请号：US13631959
申请日：2012-09-29
IPC分类号： H05K1/11 , H05K3/00 , H01L23/538 , H01L23/00 , H05K1/18 , H05K3/46 , H01L23/498
CPC分类号： H05K1/112 , H01L21/568 , H01L23/49822 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2924/18162 , H05K1/185 , H05K3/007 , H05K3/0097 , H05K3/4682 , H05K2201/0355 , H05K2203/0152 , H05K2203/0369 , H05K2203/0384 , H05K2203/1536 , H05K2203/308
摘要： Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.
摘要翻译： 描述了用于其制造的电子组件和方法，包括与形成包括载体和位于载体上的树脂涂覆的铜层的组件有关的组件。 树脂涂覆的铜层包括第一层和第二层，第一层包含树脂和第二层铜，第一层粘合到第二层。 树脂涂覆的铜的第一层位于载体和涂覆有树脂的铜的第二层之间。 在涂覆有树脂的铜的第二层上形成开口。 模具位于开口中。 多个电介质层和金属通路位于第二层和裸片上。 描述和要求保护其他实施例。
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公开(公告)号：US20140326441A1
公开(公告)日：2014-11-06
申请号：US14270343
申请日：2014-05-05
申请人： Poh Seng LEE , Liwen JIN , Xin Xian KONG , Wai Shing KUNG , Alan Boon Hong NG , Yi Jing KOAY
发明人： Poh Seng LEE , Liwen JIN , Xin Xian KONG , Wai Shing KUNG , Alan Boon Hong NG , Yi Jing KOAY
IPC分类号： F28F3/02
CPC分类号： H01L23/367 , F28F3/02 , F28F13/06 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention involves both the geometrical specification of a structure and positioning the structure in the cluster layout to achieve rapid heating/cooling as a medium transverses through them, and with little pressure drop penalty.
摘要翻译： 本发明涉及结构的几何规格并将结构定位在群集布局中，以便当介质通过它们横切时实现快速加热/冷却，并且几乎没有压降损失。
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公开(公告)号：US20140177193A1
公开(公告)日：2014-06-26
申请号：US13725104
申请日：2012-12-21
申请人： Liwen Jin , Dilan Seneviratne
发明人： Liwen Jin , Dilan Seneviratne
CPC分类号： H01L24/82 , H01L21/6835 , H01L23/49822 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L2221/68345 , H01L2224/04105 , H01L2224/73267 , H01L2224/82002 , H01L2224/82031 , H01L2224/821 , H01L2224/82375 , H01L2224/82399 , H01L2224/82862 , H05K1/185 , H05K3/4682 , H05K2203/0152
摘要： An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.
摘要翻译： 一个实例包括包括具有下模表面的微电子管芯，平行于下模表面的上模表面和管芯侧的管芯封装，该微电子管芯包括有源区和非活性区。 该实施例可选地包括具有较低释放层表面的释放层，平行于下释放层表面的上释放层表面，以及至少一个剥离层侧，该释放层与微电子管芯的上表面热连通 具有裸片的非活性区域并与活性区电绝缘。 该实施例可选地包括封装模具侧和剥离层侧和下剥离层表面的封装材料，封装材料包括基本上平行于模具下表面的下表面和基本上平行于模具上表面的上表面。
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4.发明申请公开(公告)号：US20110287074A1
公开(公告)日：2011-11-24
申请号：US13114250
申请日：2011-05-24
申请人： Liwen Jin , Ronald Howard Baney
发明人： Liwen Jin , Ronald Howard Baney
IPC分类号： A61K8/02 , A61K8/22 , A61K8/58 , A61K31/695 , A61K31/7048 , A61K36/31 , A61K36/28 , A61K38/02 , A61Q17/04 , A61K36/06 , A61Q19/02 , A01N55/10 , A61L9/00 , A61Q15/00 , C07F7/18 , A01P1/00 , A61Q19/08 , A61P17/00 , A61P17/10 , A61P39/06 , A61P31/00 , A61P31/10 , A61Q11/00 , B05D3/00 , A61K9/70 , A61K8/69
CPC分类号： C09J121/00 , A01N55/00 , A61K8/585 , A61K31/695 , A61K31/7048 , A61K45/06 , A61L15/46 , A61L31/146 , A61L31/16 , A61L2300/216 , A61L2300/404 , A61Q11/00 , A61Q15/00 , A61Q17/005 , A61K2300/00 , A01N25/04 , A01N25/10
摘要： Disclosed herein are a variety of applications for an antimicrobial agent. The antimicrobial agent comprises a silanol containing molecule, the silanol containing molecule comprising silanols (R1R2R3SiOH), siloxanediols HO(R1R2SiO)nH, siloxanols HO(R1R2SiO)nSiR1R2R3 or combinations thereof, where R1, R2 and R3 are selected from alkyl or fluoroalkyl moieties having 1 to 4 carbon atoms, vinyl or aryl groups and n is less than about 6.
摘要翻译： 本文公开了抗微生物剂的各种应用。 抗微生物剂包含含硅烷醇的分子，含硅烷醇的分子包含硅烷醇（R1R2R3SiOH），硅氧烷醇HO（R1R2SiO）nH，硅氧烷醇HO（R1R2SiO）nSiR1R2R3或其组合，其中R1，R2和R3选自烷基或氟烷基部分， 1至4个碳原子，乙烯基或芳基，n小于约6。
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公开(公告)号：US20150181713A1
公开(公告)日：2015-06-25
申请号：US14227697
申请日：2014-03-27
申请人： Ching-Ping Janet Shen , Charan K. Gurumurthy , Dilan Seneviratne , Ravi Shankar , Liwen Jin , Deepak Arora
发明人： Ching-Ping Janet Shen , Charan K. Gurumurthy , Dilan Seneviratne , Ravi Shankar , Liwen Jin , Deepak Arora
CPC分类号： H05K1/183 , B32B3/263 , B32B7/12 , B32B15/08 , B32B15/20 , B32B37/10 , B32B37/1284 , B32B2307/202 , B32B2457/08 , H01L23/13 , H01L23/5389 , H01L2924/0002 , H05K1/185 , H05K3/284 , Y10T428/24612 , Y10T428/2495 , Y10T428/31678 , H01L2924/00
摘要： Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.
摘要翻译： 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，制造可释放的芯板的技术可以包括将内箔连接到基底上，将粘合剂层定位在内箔上，使得内箔基本上与基底的周边齐平，将外导电 或者利用保护材料覆盖粘合层，内箔和外导电箔之间的界面。
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公开(公告)号：US20140090879A1
公开(公告)日：2014-04-03
申请号：US13631959
申请日：2012-09-29
CPC分类号： H05K1/112 , H01L21/568 , H01L23/49822 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2924/18162 , H05K1/185 , H05K3/007 , H05K3/0097 , H05K3/4682 , H05K2201/0355 , H05K2203/0152 , H05K2203/0369 , H05K2203/0384 , H05K2203/1536 , H05K2203/308
摘要： Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.
摘要翻译： 描述了用于其制造的电子组件和方法，包括与形成包括载体和位于载体上的树脂涂覆的铜层的组件有关的组件。 树脂涂覆的铜层包括第一层和第二层，第一层包含树脂和第二层铜，第一层粘合到第二层。 树脂涂覆的铜的第一层位于载体和涂覆有树脂的铜的第二层之间。 在涂覆有树脂的铜的第二层上形成开口。 模具位于开口中。 多个电介质层和金属通路位于第二层和裸片上。 描述和要求保护其他实施例。
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