WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE

Invention Application

US20140183728A1 WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE 有权

Title translation: 波形支撑结构，包括波形支撑结构的半导体封装的中间结构

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Patent Title: WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE
Patent Title (中): 波形支撑结构，包括波形支撑结构的半导体封装的中间结构
Application No.: US14147051

Application Date: 2014-01-03
Publication No.: US20140183728A1

Publication Date: 2014-07-03
Inventor: Jun-Won HAN , Jae-Hyun KIM , Tae-Hoon KIM , Ho-Geun LEE , You-Jeong JEONG , Jung-Sik CHOI
Applicant: Jun-Won HAN , Jae-Hyun KIM , Tae-Hoon KIM , Ho-Geun LEE , You-Jeong JEONG , Jung-Sik CHOI
Priority: KR10-2013-0000484 20130103
Main IPC: H01L23/00
IPC: H01L23/00 ; B32B7/06

WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE

Abstract:

A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.

Abstract(Chinese):

晶片支撑结构包括用于支撑晶片的支撑衬底，用于将晶片从支撑衬底分离的释放层以及用于将晶片附接到支撑衬底的粘合剂层。

Public/Granted literature

US09076701B2 Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure Public/Granted day:2015-07-07

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）