Invention Application
- Patent Title: GROUNDING STRUCTURES FOR A RECEPTACLE ASSEMBLY
- Patent Title (中): 接收装置的接地结构
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Application No.: US13735386Application Date: 2013-01-07
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Publication No.: US20140194004A1Publication Date: 2014-07-10
- Inventor: Justin Dennis Pickel , Alex Michael Sharf
- Applicant: TYCO ELECTRONICS CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A receptacle assembly includes a contact module including a holder having a first side and an opposite second side. The holder holds a plurality of contacts. The contacts extend from the holder for electrical termination. A first ground shield is coupled to the first side. The first ground shield has grounding beams extending forward of the holder for electrical connection to a header assembly. The first ground shield has ground skewers extending into the holder. A second ground shield is coupled to the second side. The second ground shield has grounding beams extending forward of the holder for electrical connection to the header assembly. The second ground shield has ground skewers extending into the holder and the frame assembly. The ground skewers of the second ground shield engage and electrically connect to corresponding ground skewers of the first ground shield.
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