Invention Application
- Patent Title: FinFET Device and Method of Fabricating Same
- Patent Title (中): FinFET器件及其制造方法
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Application No.: US13902322Application Date: 2013-05-24
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Publication No.: US20140197457A1Publication Date: 2014-07-17
- Inventor: Chih-Hao Wang , Kuo-Cheng Ching , Gwan Sin Chang , Zhiqiang Wu
- Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66

Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate having isolation regions, a gate region, source and drain regions separated by the gate region, a first fin structure in a gate region. The first fin structure includes a first semiconductor material layer as a lower portion of the first fin structure, a semiconductor oxide layer as an outer portion of a middle portion of the first fin structure, the first semiconductor material layer as a center portion of the middle portion of the first fin structure and a second semiconductor material layer as an upper portion of the first fin structure. The semiconductor device also includes a source/drain feature over the substrate in the source/drain region between two adjacent isolation regions and a high-k (HK)/metal gate (MG) stack in the gate region, wrapping over a portion of the first fin structure.
Public/Granted literature
- US09318606B2 FinFET device and method of fabricating same Public/Granted day:2016-04-19
Information query
IPC分类: