Invention Application
US20140203432A1 Method for Packaging Quad Flat Non-Leaded Package Body, and Package Body
有权
封装四边形非引线封装体和封装体的方法
- Patent Title: Method for Packaging Quad Flat Non-Leaded Package Body, and Package Body
- Patent Title (中): 封装四边形非引线封装体和封装体的方法
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Application No.: US14224202Application Date: 2014-03-25
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Publication No.: US20140203432A1Publication Date: 2014-07-24
- Inventor: Kai Chen , Zhihua Liu , Ran Jiang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201210284822.8 20120810
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498

Abstract:
A method for packaging a quad flat non-leaded (QFN) package body. The method includes: etching an upper surface of a metal plate to process a groove to form a bond wire bench, a component bench, and a bump; processing the bump to a preset height, and assembling a component on the component bench; packaging the processed metal plate to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a bottom lead. In the present invention, large passive components can be stacked on the QFN package body with a top lead; the structure is simplified while the reliability of the welding joints is improved; a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.
Public/Granted literature
- US09224620B2 Method for packaging quad flat non-leaded package body, and package body Public/Granted day:2015-12-29
Information query
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