公开(公告)号：US09224620B2

公开(公告)日：2015-12-29

申请号：US14224202

申请日：2014-03-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kai Chen ,  Zhihua Liu ,  Ran Jiang

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/4828 ,  H01L21/4825 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48249 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for packaging a quad flat non-leaded (QFN) package body. The method includes: etching an upper surface of a metal plate to process a groove to form a bond wire bench, a component bench, and a bump; processing the bump to a preset height, and assembling a component on the component bench; packaging the processed metal plate to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a bottom lead. In the present invention, large passive components can be stacked on the QFN package body with a top lead; the structure is simplified while the reliability of the welding joints is improved; a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.

Abstract translation: 一种用于封装四边形非引线（QFN）封装体的方法。 该方法包括：蚀刻金属板的上表面以处理凹槽以形成接合线台，组件台和凸块; 将凸块加工成预设高度，并将组件组装在组件台上; 包装加工后的金属板以形成包装体，并且将经处理的凸块的表面暴露在包装体的上表面上以形成顶部引线; 并蚀刻包装体的下表面以处理底部引线。 在本发明中，可以使用顶部引线将大的无源部件堆叠在QFN封装主体上; 简化了结构，提高了焊接接头的可靠性; 可以通过顶部引线堆叠多个部件以克服部件堆叠的限制。

公开(公告)号：US20220131510A1

公开(公告)日：2022-04-28

申请号：US17570575

申请日：2022-01-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaomin Zhang ,  Mingli Huang ,  Ran Jiang

IPC: H03F3/24 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

Abstract: A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.

公开(公告)号：US20140203432A1

公开(公告)日：2014-07-24

申请号：US14224202

申请日：2014-03-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kai Chen ,  Zhihua Liu ,  Ran Jiang

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4828 ,  H01L21/4825 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48249 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for packaging a quad flat non-leaded (QFN) package body. The method includes: etching an upper surface of a metal plate to process a groove to form a bond wire bench, a component bench, and a bump; processing the bump to a preset height, and assembling a component on the component bench; packaging the processed metal plate to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a bottom lead. In the present invention, large passive components can be stacked on the QFN package body with a top lead; the structure is simplified while the reliability of the welding joints is improved; a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.

Abstract translation: 一种用于封装四边形非引线（QFN）封装体的方法。 该方法包括：蚀刻金属板的上表面以处理凹槽以形成接合线台，组件台和凸块; 将凸块加工成预设高度，并将组件组装在组件台上; 包装加工后的金属板以形成包装体，并且将经处理的凸块的表面暴露在包装体的上表面上以形成顶部引线; 并蚀刻包装体的下表面以处理底部引线。 在本发明中，可以使用顶部引线将大的无源部件堆叠在QFN封装主体上; 简化了结构，提高了焊接接头的可靠性; 可以通过顶部引线堆叠多个部件以克服部件堆叠的限制。

公开(公告)号：US20140353824A1

公开(公告)日：2014-12-04

申请号：US14308454

申请日：2014-06-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ran Jiang

IPC: H01L25/065 ,  H01L23/12 ,  H01L23/00

Abstract: The present invention discloses a package-on-package structure including a top package and a bottom package from top to bottom, where the bottom package includes a first substrate and a second substrate from top to bottom; a pad is placed on one surface of the first substrate, where the pad is electrically connected to the top package; a chip is placed on the other surface of the first substrate; the second substrate is placed opposite to and below the chip; a first metal terminal is placed at a position that is between the first substrate and the second substrate and bypasses the chip; the first substrate is electrically connected to one surface of the second substrate by using the first metal terminal; and a second metal terminal is placed on the other surface of the second substrate. The present invention is applicable to electronic component packaging.

Abstract translation: 本发明公开了一种包装封装结构，其包括从顶部到底部的顶部封装和底部封装，其中底部封装包括从顶部到底部的第一基板和第二基板; 衬垫放置在第一衬底的一个表面上，其中衬垫电连接到顶部封装; 将芯片放置在第一基板的另一个表面上; 第二基板放置在芯片的相对和下方; 将第一金属端子放置在第一基板和第二基板之间的位置，并绕过芯片; 第一基板通过使用第一金属端子电连接到第二基板的一个表面; 并且第二金属端子被放置在第二基板的另一个表面上。 本发明可应用于电子部件包装。