Invention Application
- Patent Title: ELECTROSTATIC CHUCK WITH CONCENTRIC COOLING BASE
- Patent Title (中): 具有集中冷却基座的静电卡盘
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Application No.: US14162510Application Date: 2014-01-23
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Publication No.: US20140209596A1Publication Date: 2014-07-31
- Inventor: Dmitry LUBOMIRSKY , Kyle TANTIWONG , Samer BANNA
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
Embodiments of the present disclosure generally provide apparatus and method for cooling a substrate support in a uniform manner. One embodiment of the present disclosure provides a cooling assembly for a substrate support. The cooling assembly includes a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support, a diffuser disposed on a second side of the cooling base, wherein the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner, and an inlet/outlet plate disposed under the diffuser, wherein the inlet/outlet plate is provides an interface between the diffuser and an inlet and outlet of a cooling fluid.
Public/Granted literature
- US09659803B2 Electrostatic chuck with concentric cooling base Public/Granted day:2017-05-23
Information query
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